Important information
- To find out more about the iBond Series, you should read the issue circular.
Important dates
- Subscription period: Monday 11 July 2011 9:00 a.m. to Tuesday 19 July 2011 2:00 p.m.
- Expected issue date: Wednesday, 28 July 2011
Applications
- You can apply through a Placing Bank, HKSCC or a securities broker who is willing and able to make application for you. Further information in relation to the application of the iBond Series is available in the issue circular.
- Some of the Placing Banks are also appointed as Market Makers. If you are applying through a Placing Bank, whether your Placing Bank is also appointed as a Market Maker may affect your ability in selling the bonds before maturity in the future.
- As at 5 July 2011, the following banks are appointed as Placing Banks for the iBond Series:
Bank of China (Hong Kong) Limited |
Bank of Communications Co., Ltd. Hong Kong Branch |
The Bank of East Asia, Limited |
China Construction Bank (Asia) Corporation Limited |
Chiyu Banking Corporation Limited |
Chong Hing Bank Limited |
CITIC Bank International Limited |
Dah Sing Bank Limited |
DBS Bank (Hong Kong) Limited |
Fubon Bank (Hong Kong) Limited |
Hang Seng Bank, Limited |
HSBC |
Industrial and Commercial Bank of China (Asia) Limited |
Nanyang Commercial Bank, Limited |
Shanghai Commercial Bank Limited |
Standard Chartered Bank (Hong Kong) Limited |
Wing Hang Bank, Limited |
Wing Lung Bank Limited |
Placing Banks |
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Citibank (Hong Kong) Limited |
Public Bank (Hong Kong) Limited |
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- Any application for the iBond series should be made solely on the basis of the information contained in the issue circular and the programme circular.
Application restrictions
- You can only apply for the iBond Series if you hold a valid Hong Kong identity card.
Multiple applications not allowed
- You may only submit one application for the iBond Series. Multiple applications may be rejected in full.