iBond Series - Highlights

iBond due 2019 (Issue No. 03GB1906R; Stock Code 4231)

Important information

  • To find out more about the iBond Series, you should read the issue circular.

Subscription period

  • Tuesday, 31 May 2016 9:00 am to Wednesday, 8 June 2016 2:00 pm
  • Expected issue date

  • Monday, 20 June 2016

    Expected listing date

  • Tuseday, 21 June 2016


  • You can apply through a Placing Bank, HKSCC or a securities broker who is willing and able to make application for you. Further information in relation to the application of the iBond Series is available in the issue circular.
  • Some of the Placing Banks are also appointed as Market Makers. If you are applying through a Placing Bank, whether your Placing Bank is also appointed as a Market Maker may affect your ability in selling the bonds before maturity in the future.
  • As at 19 May 2016, the following banks are appointed as Placing Banks for the iBond Series:
Placing Banks who are also appointed as Market Makers

Bank of China (Hong Kong) Limited

Bank of Communications Co., Ltd. Hong Kong Branch

The Bank of East Asia, Limited

China CITIC Bank International Limited

China Construction Bank (Asia) Corporation Limited

Chiyu Banking Corporation Limited

Chong Hing Bank Limited

Dah Sing Bank, Limited

DBS Bank (Hong Kong) Limited

Fubon Bank (Hong Kong) Limited

Hang Seng Bank Limited


Hong Leong Bank Berhad, Hong Kong Branch

Industrial and Commercial Bank of China (Asia) Limited

Nanyang Commercial Bank, Limited

OCBC Wing Hang Bank Limited

Shanghai Commercial Bank Limited

Standard Chartered Bank (Hong Kong) Limited

Wing Lung Bank Limited

Placing Banks

Citibank (Hong Kong) Limited

Public Bank (Hong Kong) Limited

Application restrictions

  • You can only apply for the iBond Series if you hold a valid Hong Kong identity card.

Multiple applications not allowed

  • You may only submit one application for the iBond Series. Multiple applications will be rejected in full.