iBond Series - Highlights

iBond due 2024 (Issue No. 03GB2406R; Stock Code 4246)

Important information

  • To find out more about the iBond Series, you should read the issue circular.

Subscription period

  • Tuesday, 1 June 2021 9:00 am to Friday, 11 June 2021 2:00 pm
  • Expected issue date

  • Wednesday, 23 June 2021

    Expected listing date

  • Thursday, 24 June 2021


  • You can apply through a Placing Bank, HKSCC or a securities broker who is willing and able to make application for you. Further information in relation to the application of the iBond Series is available in the issue circular.
  • Some of the Placing Banks are also appointed as Market Makers. If you are applying through a Placing Bank, whether your Placing Bank is also appointed as a Market Maker may affect your ability in selling the bonds before maturity in the future.
  • As at 12 May 2021, the following banks are appointed as Placing Banks for the iBond Series:
Bank of China (Hong Kong) Limited*
Bank of Communications (Hong Kong) Limited*
The Bank of East Asia, Limited*
China CITIC Bank International Limited*
China Construction Bank (Asia) Corporation Limited*
Chiyu Banking Corporation Limited*
Chong Hing Bank Limited*
Citibank (Hong Kong) Limited 
CMB Wing Lung Bank Limited
Dah Sing Bank, Limited*
DBS Bank (Hong Kong) Limited
Fubon Bank (Hong Kong) Limited*
Hang Seng Bank Limited 
The Hongkong and Shanghai Banking Corporation Limited*
Industrial and Commercial Bank of China (Asia) Limited*
Nanyang Commercial Bank, Limited*
OCBC Wing Hang Bank Limited*
Public Bank (Hong Kong) Limited
Shanghai Commercial Bank Limited
Standard Chartered Bank (Hong Kong) Limited*
* Placing Banks which are also appointed as Market Makers

Application restrictions

  • You can only apply for the iBond Series if you hold a valid Hong Kong identity card.

Multiple applications not allowed

  • You may only submit one application for the iBond Series. Multiple applications will be rejected in full.