iBond Series - Highlights
iBond due 2024 (Issue No. 03GB2406R; Stock Code 4246)
Important information
- To find out more about the iBond Series, you should read the issue circular.
Subscription period
- Tuesday, 1 June 2021 9:00 am to Friday, 11 June 2021 2:00 pm
Expected issue date
- Wednesday, 23 June 2021
Expected listing date
- Thursday, 24 June 2021
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Applications
- You can apply through a Placing Bank, HKSCC or a securities broker who is willing and able to make application for you. Further information in relation to the application of the iBond Series is available in the issue circular.
- Some of the Placing Banks are also appointed as Market Makers. If you are applying through a Placing Bank, whether your Placing Bank is also appointed as a Market Maker may affect your ability in selling the bonds before maturity in the future.
- As at 12 May 2021, the following banks are appointed as Placing Banks for the iBond Series:
Bank of China (Hong Kong) Limited* |
Bank of Communications (Hong Kong) Limited* |
The Bank of East Asia, Limited* |
China CITIC Bank International Limited* |
China Construction Bank (Asia) Corporation Limited* |
Chiyu Banking Corporation Limited* |
Chong Hing Bank Limited* |
Citibank (Hong Kong) Limited |
CMB Wing Lung Bank Limited |
Dah Sing Bank, Limited* |
DBS Bank (Hong Kong) Limited |
Fubon Bank (Hong Kong) Limited* |
Hang Seng Bank Limited |
The Hongkong and Shanghai Banking Corporation Limited* |
Industrial and Commercial Bank of China (Asia) Limited* |
Nanyang Commercial Bank, Limited* |
OCBC Wing Hang Bank Limited* |
Public Bank (Hong Kong) Limited |
Shanghai Commercial Bank Limited |
Standard Chartered Bank (Hong Kong) Limited* |
|
* Placing Banks which are also appointed as Market Makers |
Application restrictions
- You can only apply for the iBond Series if you hold a valid Hong Kong identity card.
Multiple applications not allowed
- You may only submit one application for the iBond Series. Multiple applications will be rejected in full.