iBond Series - Highlights

iBond due 2017 (Issue No. 03GB1708R; Stock Code 4222)

Important information

  • To find out more about the iBond Series, you should read the issue circular.

Subscription period

  • Wednesday, 23 July 2014 9:00 am to Thursday, 31 July 2014 2:00 pm
  • Expected issue date

  • Monday, 11 August 2014

    Expected listing date

  • Tuesday, 12 August 2014

Applications

  • You can apply through a Placing Bank, HKSCC or a securities broker who is willing and able to make application for you. Further information in relation to the application of the iBond Series is available in the issue circular.
  • Some of the Placing Banks are also appointed as Market Makers. If you are applying through a Placing Bank, whether your Placing Bank is also appointed as a Market Maker may affect your ability in selling the bonds before maturity in the future.
  • As at 18 July 2014, the following banks are appointed as Placing Banks for the iBond Series:
Placing Banks who are also appointed as Market Makers

Bank of China (Hong Kong) Limited

Bank of Communications Co., Ltd. Hong Kong Branch

The Bank of East Asia, Limited

China CITIC Bank International Limited

China Construction Bank (Asia) Corporation Limited

Chiyu Banking Corporation Limited

Chong Hing Bank Limited

Dah Sing Bank, Limited

DBS Bank (Hong Kong) Limited

Fubon Bank (Hong Kong) Limited

Hang Seng Bank Limited

HSBC

Hong Leong Bank Berhad, Hong Kong Branch

Industrial and Commercial Bank of China (Asia) Limited

Nanyang Commercial Bank, Limited

Standard Chartered Bank (Hong Kong) Limited

Shanghai Commercial Bank Limited

Wing Hang Bank, Limited

Wing Lung Bank Limited

Placing Banks

Citibank (Hong Kong) Limited

Public Bank (Hong Kong) Limited

Application restrictions

  • You can only apply for the iBond Series if you hold a valid Hong Kong identity card.

Multiple applications not allowed

  • You may only submit one application for the iBond Series. Multiple applications may be rejected in full.